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Features

  • Copper bonded diamond polishing pad designed for fast stock removal — lasts longer than standard resin bond pads
  • 3mm thick flexible design allows use on flat surfaces, radius edges, and bowl polishing
  • Use CopperFlex for initial shaping and polishing (grits 50-200), then switch to standard resin bond pads starting at 400 grit to complete the polishing process
  • Compatible with granite, marble, concrete, and engineered stone
  • 4-inch diameter with hook and loop (Velcro) backing for quick pad changes
  • Available in 50, 100, 200, and 400 grit for progressive stock removal

Product Specifications

Part No. Grit Application Stage
15501 50 Coarse Stock Removal
15502 100 Medium Stock Removal
15503 200 Fine Stock Removal
15504 400 Pre-Polish / Transition to Resin

Technical Specifications

Diameter 4 inches (100 mm)
Thickness 3 mm
Bond Type Copper (longer-lasting than resin bond)
Attachment Hook and Loop (Velcro)
Application Wet
Compatible Materials Granite, Marble, Concrete, Engineered Stone
Usage Flat surfaces, radius edges, bowl polishing
Country of Origin China
HS Code 6804.21.0000

Variant Details

▸ Grit 50 — Part #15501
Spec Value
Part Number 15501
Grit 50
▸ Grit 100 — Part #15502
Spec Value
Part Number 15502
Grit 100
▸ Grit 200 — Part #15503
Spec Value
Part Number 15503
Grit 200
▸ Grit 400 — Part #15504
Spec Value
Part Number 15504
Grit 400